Dynamic simulation of a chiller for a semiconductor fabrication process

초록

In many semiconductor fabrication processes, the heat produced in the process is needed to be removed. For this purpose, a chiller with a periodical cooling/idling cycle is used. To simulate the performance of the chiller, mathematical heat exchanger models which are based on the mass and energy balance were developed using the moving boundary approaches. The heat exchangers were divided into two regions in the evaporator and three regions in the condenser. All component models were integrated to simulate the chiller responses under the cooling load cycles using the EES program. The results showed that the model described the chiller responses quite well. In the idling process, the COP decreased because the compressor power consumption was almost the same as in the cooling process. It is suggested that the electricity consumption of the compressor can be reduced if the rotation speed is decreased in the idling process.