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Fatigue Life of Solder Joints in a Printed Circuit Board as a Function of the Cracking Energy Density, Temperature and Frequency
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- Fatigue Life of Solder Joints in a Printed Circuit Board as a Function of the Cracking Energy Density, Temperature and Frequency
- 저자
- 정현용
- 발행일
- 2013-11-19
- 학회명
- ASME 2013 INTERNATIONAL MECHANICAL ENGINEERING CONGRESS & EXPOSITION