분무 증발을 이용한 칩 냉각 향상에 대한 수치적 연구

NUMERICAL STUDY OF CHIP COOLING ENHANCEMENT WITH EVAPORATING MIST FLOW

초록

The heat transfer enhancement of heat sink with mist flow is studied numerically by solving the conservation equations for mass, momentum and energy in the continuous and dispersed phases. A Lagrangian method is used for tracing dispersed water droplets in the heat sink and an Eulerian species transport model for air and steam mixture. The continuous and dispersed phases are interacted with the drag and evaporation source terms. The computed results show that addition of evaporating mist droplets enhances the cooling performance of heat sink significantly.

키워드

농도장 방정식(Species Transport Equation)분무 증발(Mist Evaporation)히트 싱크(Heat Sink)DPM(Discrete Phase Model)
제목
분무 증발을 이용한 칩 냉각 향상에 대한 수치적 연구
제목 (타언어)
NUMERICAL STUDY OF CHIP COOLING ENHANCEMENT WITH EVAPORATING MIST FLOW
저자
노상은김동철손기헌
DOI
10.6112/kscfe.2013.18.2.009
발행일
2013-06
저널명
한국전산유체공학회지
18
2
페이지
9 ~ 16