TC-NCF 접합 공정의 다상유동에 대한 수치적 연구

초록

Thermo-compression (TC) bonding using non-conductive films (NCF) and micro solder bumps has became a key technology for interconnecting upper and lower chips in high-bandwidth memory (HBM) packaging. In this study, a comprehensive numerical model is proposed to analyze the TC-NCF process by simultaneously considering solder phase change, wetting-driven flow, NCF curing kinetics, and interfacial evolution driven by the displacement of the upper chip. A Volume-of-Fluid (VOF) method is employed to capture the multiphase flow behavior among air, NCF, and solder, including wall wetting dynamics. The melting and solidification of solder are modeled using an enthalpy-based phase change approach, while the compression induced by the upper chip is represented through a dynamic mesh technique. The proposed model provides a quantitative framework for analyzing the coupled effects of process parameters and material properties, thereby offering a theoretical foundation for the design and optimization of thermo-compression bonding processes.

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