Measurement and analysis of micro-scale adhesion for efficient transfer printing

초록

The adhesion-based transfer printing process allows the devices to be fabricated through low temperature process, which is important for realizing flexible electronics with high mobility. Therefore, comprehensive understanding about adhesion between the solid object and the surface of elastomeric stamp (generally, polydimethylsiloxane is used) and the optimal strategy to control adhesion can support the effective and high yield transfer. In this paper, a novel adhesive force measurement system is developed to measure dynamic adhesive forces from the surface on the flexible stamp. The thermodynamic work of adhesion at the moment of debonding of a tip of sensor from the flexible stamp is modeled and used for developing the adhesion control strategy. The measurement results show that the work of adhesion is strongly dependent on the peel-off velocity of tip, while the indentation force has only minor effects on it. The effect of Young's modulus of elastomeric stamp is also investigated using the model of work of adhesion based on the relation between the adhesive force and peel-off velocity. The elastomeric stamp with low Young's modulus is preferred for efficient transfer printing. (C) 2011 American Institute of Physics. [doi:10.1063/1.3611033]

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