ScholarWorks@서강대학교

상세 보기

Phase-field approach to thermo-mechanical behavior of through-silicon vias

제목
Phase-field approach to thermo-mechanical behavior of through-silicon vias
저자
김동철
발행일
2018-10-31
학회명
9TH INTERNATIONAL CONFERENCE ON MULTISCALE MATERIALS MODELING

ScholarWorks@서강대학교

04107 서울특별시 마포구 백범로 35 (신수동) 서강대학교 Tel. 02-705-8114

COPYRIGHT © 서강대학교 All Rights Reserved.

Certain data included herein are derived from the © Web of Science of Clarivate Analytics. All rights reserved.

You may not copy or re-distribute this material in whole or in part without the prior written consent of Clarivate Analytics.