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Phase-field approach to thermo-mechanical behavior of through-silicon vias
- 제목
- Phase-field approach to thermo-mechanical behavior of through-silicon vias
- 저자
- 김동철
- 발행일
- 2018-10-31
- 학회명
- 9TH INTERNATIONAL CONFERENCE ON MULTISCALE MATERIALS MODELING
- 개최국가
- 일본