ScholarWorks@서강대학교

상세 보기

Phase-field Approach to Thermo-mechanical Behavior of Through-silicon Vias

제목
Phase-field Approach to Thermo-mechanical Behavior of Through-silicon Vias
저자
김동철
발행일
2019-07-05
학회명
6TH KOREA MULTI-SCALE MECHANICS 2019 SYMPOSIUM (KMSM 2019)

ScholarWorks@서강대학교

04107 서울특별시 마포구 백범로 35 (신수동) 서강대학교 Tel. 02-705-8114

COPYRIGHT © 서강대학교 All Rights Reserved.

Certain data included herein are derived from the © Web of Science of Clarivate Analytics. All rights reserved.

You may not copy or re-distribute this material in whole or in part without the prior written consent of Clarivate Analytics.