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Phase-field Approach to Thermo-mechanical Behavior of Through-silicon Vias
- 제목
- Phase-field Approach to Thermo-mechanical Behavior of Through-silicon Vias
- 저자
- 김동철
- 발행일
- 2019-07-05
- 학회명
- 6TH KOREA MULTI-SCALE MECHANICS 2019 SYMPOSIUM (KMSM 2019)
- 개최국가
- 대한민국