저함량 h-BN이 첨가된 유리섬유 강화 PEI의 열응답 및 기계적 특성

초록

Glass fiber–reinforced polyetherimide (PEI) composites are widely used as materials for semiconductor burn-in sockets. However, their heat dissipation capability remains limited. In this study, the effects of low-content hexagonal boron nitride (h-BN) addition on the thermal response and mechanical properties of a commercial glass fiber–reinforced PEI composite (SF2255) aresystematically investigated, with consideration given to manufacturing feasibility. SF2255-based composites containing different h-BN weight fractions (0.1–3.0 wt%) are fabricatedvia melt compounding and injection molding, and the resulting specimens are evaluatedthrough tensile testing and transient heating experiments. The tensile strength increaseswith h-BN content up to 0.5 wt% and subsequently decreases, while the elastic modulus remainsnearly unchanged up to 1.0 wt% h-BN but exhibitsa noticeable reduction at 3.0 wt%. The temperature rise rate (ΔT/Δt), evaluated in the intermediate transient regime, increaseswith increasing h-BN content, and a notable improvement in thermal response is observedat h-BN loadings of 1.0 wt% and above. In addition, thermal conductivity is estimatedthrough a one-dimensional transient heat conduction analysis, showinga progressive increase with h-BN content. These results suggestthat a low-content h-BN filler design can achievea favorable balance between mechanical stability and thermal performance in glass fiber–reinforced PEI composites intended for burn-in socket applications.

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