Delay Impact on Process Variation of Interconnect throughout technology scaling

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초록

As the feature size of integrated circuits decreases, interconnect delay has become one of the major factors on performance. This research was conducted to verify the delay impact of interconnect variation throughout technology scaling. Process variations and timing models are considered simultaneously at various semiconductor technologies. Experimental results show the interconnect variation has a great effect on circuit performance especially below 10 nm design.

키워드

Interconnect variationElmore delayprocess variationscapacitanceresistanceEXTRACTION
제목
Delay Impact on Process Variation of Interconnect throughout technology scaling
저자
Jin, MyeongwooOh, DoekkeunKim, Juho
DOI
10.1109/ISOCC56007.2022.10031498
발행일
2022-10
유형
Proceedings Paper
저널명
2022 19TH INTERNATIONAL SOC DESIGN CONFERENCE (ISOCC)
페이지
388 ~ 389