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Delay Impact on Process Variation of Interconnect throughout technology scaling
- Jin, Myeongwoo;
- Oh, Doekkeun;
- Kim, Juho
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2초록
As the feature size of integrated circuits decreases, interconnect delay has become one of the major factors on performance. This research was conducted to verify the delay impact of interconnect variation throughout technology scaling. Process variations and timing models are considered simultaneously at various semiconductor technologies. Experimental results show the interconnect variation has a great effect on circuit performance especially below 10 nm design.
키워드
Interconnect variation; Elmore delay; process variations; capacitance; resistance; EXTRACTION
- 제목
- Delay Impact on Process Variation of Interconnect throughout technology scaling
- 저자
- Jin, Myeongwoo; Oh, Doekkeun; Kim, Juho
- 발행일
- 2022-10
- 유형
- Proceedings Paper
- 저널명
- 2022 19TH INTERNATIONAL SOC DESIGN CONFERENCE (ISOCC)
- 페이지
- 388 ~ 389